Different methods should be selected according to the nature, shape and requirements of the parts. For example, if the suitable acid -plated copper can be applied to the plating substrate after the surface is activated, the copper plating and nickel plating can be plated. It is not suitable for acidic copper or iron plating matrix to dew, and nickel plating should be plated directly after the surface is activated.

The specific method is as follows: The chromium -plated parts with chromium plated, eliminate the parts of the plating and peeling parts, and choose the method as follows according to the specific conditions of the parts.

(1) Appropriate copper plating and nickel: oil removal (preferably chemical method) is cleaned, one water throwing and scrubbing (large parts), one desertic acid hydrochloric acid to clean, a dilute sulfuric acid, an acid -plated copper Sulfuric acid etching one nickel is cleaned with chrome, a chrome, one washed (recycled) and a dry and one inspection.

(2) Suitable nickel -plated: Oil removal (preferably chemical method) is cleaned, one water throwing and brushing (large parts) one lonely hydrochloric acid activation, one nickel plating, one chrome, one cleaning (recycling), one drying, one drying, one drying, one drying, one drying, one drying one, one drying and one drying and one drying one. Send inspection.

(3) The use of electricity throwing activation method can also achieve better results. Formula and process parameters:

The amount of industrial sulfuric acid (density L.849 / ml) see the "preparation" chromicide 509 / L

Glycerin 509 / L

The density of the solution L. 58 ～ 1.629 / ml temperature room temperature

Theode current density L to 10A / DM2 time 3 ～ 5s